Engineered thermal management solutions for high-heat-flux power electronics, electric vehicle powertrains, and high-performance computing systems. Designed to minimize thermal resistance and eliminate fluid leakage across demanding operational lifecycles.
Liquid cold plates transfer high heat loads from localized sources (IGBTs, SiC modules, CPUs, laser diodes) into a circulating coolant loop. By combining direct thermal conduction with optimized internal fluid turbulence, these assemblies maintain critical component junction temperatures below failure thresholds without relying on bulky air-cooled heat sinks.
Primary Function: Direct-contact conductive heat dissipation via internal fluid flow channels.
Common Configurations: Vacuum-brazed microchannel plates, deep-drilled tube-in-plate designs, and friction stir welded (FSW) architectures.
Coolant Compatibility: Water-glycol mixtures (EG/PG), dielectric fluids, and deionized water.
Technical Specifications
|
Parameter |
Standard Capability / Range |
|
Base Material |
Aluminum (6061, 6063), Copper (C11000), Brass |
|
Internal Fin Geometries |
Louvered, offset strip, wavy, pin-fin, or plain channels |
|
Max Operating Pressure |
Up to 1.0 MPa (150 psi) standard; higher ratings available upon review |
|
Leak Testing Limit |
< 1 × 10⁻⁹ Pa·m³/s (Helium mass spectrometry) |
|
Surface Flatness |
Down to 0.02 mm across active mounting interfaces |
|
Surface Finish / Coating |
Chem film (MIL-DTL-5541), electroless nickel plating, anodizing |
Key Features
Low Thermal Resistance:
Internal fin profiles disrupt boundary layer flow to increase the convective heat transfer coefficient under restricted pressure budgets.
Monolithic Sealing Integrity:
Controlled atmosphere vacuum brazing and friction stir welding create solid-state or diffusion-bonded joints, removing internal O-rings and mechanical gaskets from the fluid path.
Optimized Pressure Drop:
Computational Fluid Dynamics (CFD)-modeled manifolds distribute coolant evenly across active areas, preventing flow stagnation zones and excessive pressure drops (ΔP).
Direct Port Integration:
O-ring face seals, NPT, BSPP, or custom quick-disconnect fittings machined or brazed directly into the plate body.
Materials & Options
Aluminum Cold Plates: Lightweight and cost-optimized for high-volume EV inverters, motor controllers, and standard server rack architectures. Typically paired with vacuum-brazed internal aluminum fin structures.
Copper Cold Plates: High thermal conductivity (391 W/m·K compared to 167 W/m·K for aluminum), deployed for concentrated high-heat-flux laser diodes and power electronics where minimum thermal resistance is mandatory.
Surface Treatments:
• Chem Film (Alodine): Preserves electrical grounding pathways while providing environmental corrosion resistance.
• Electroless Nickel Plating: Mitigates galvanic corrosion risks in mixed-metal loops or aggressive deionized water applications.
Manufacturing & Engineering Workflow
• CFD Thermal & Flow Simulation: Internal fluid paths, fin densities, and pressure drops are modeled against customer boundary conditions prior to metal cutting.
• Precision Machining: CNC multi-axis milling centers cut fluid cavities, mounting bolt patterns, and interface planes to tight geometric tolerances.
Joining & Sealing Execution:
• Vacuum Brazing: Assemblies with filler metal foil are processed in high-vacuum furnaces to bond internal extended surfaces to cover plates.
• Friction Stir Welding (FSW): Solid-state frictional heat joining used for deep-channel aluminum plates without added filler material.
• Post-Processing & Cleaning: Deburring, chemical conversion coating or plating applied per engineering drawing specifications.
Quality Control & Testing Protocol
Helium Mass Spectrometer Leak Testing: 100% of vacuum-brazed and welded assemblies undergo vacuum-mode helium tracer gas testing to detect micro-leaks.
Hydrostatic Proof Pressure Testing: Assemblies are pressurized to 1.5× maximum working pressure to verify structural integrity under load.
Coordinate Measuring Machine (CMM): Dimensional inspection verifies critical mounting hole locations, overall thickness, and interface flatness.
Cleanliness Inspection: Internal channels are flushed and dried to eliminate particulate and organic contaminants prior to port capping and packaging.
Customization & Engineering Support
Envelope & Footprint Customization: Dimensions, mounting patterns, and thermal interface planes matched to specific power semiconductor footprints (e.g., Infineon, Semikron, Fuji modules).
Co-Design Engineering: Technical teams review customer STEP files, heat flux maps (W/cm²), and flow limits (LPM) to deliver finalized internal fin specifications.
Prototyping Validation: Rapid prototyping tracks available to supply initial samples for thermal and pressure testing.
Typical Applications
Electric Vehicles (EV):
Traction inverter cooling and battery thermal management system (BTMS) chill plates.
Data Centers & HPC:
Direct-to-chip liquid cooling cold plates for high-TDP CPUs and GPUs.
Renewable Energy:
Wind turbine converters and utility-scale solar PV central inverters.
Industrial Hardware:
High-power laser cutting generators, medical MRI gradient amplifiers, and semiconductor test equipment.
Packaging & Delivery
Port Protection: Fluid ports sealed with threaded plugs or dust-resistant plastic caps to block particulate ingress during shipping.
Moisture Defense: Vacuum-sealed moisture-barrier bags containing active desiccants for international transit.
Export Framing: ISPM 15-compliant heat-treated wooden crates or reinforced corrugated cartons engineered for freight stability.
FAQ
Q: What is the typical thermal resistance of your cold plates?
A: Thermal resistance varies based on coolant flow rate, fluid composition, and heat flux density. Standard microchannel designs typically achieve thermal resistances between 0.01 and 0.05 °C/W under specified operating points. Full performance curves are provided during engineering review.
Q: What coolants are compatible with your cold plates?
A: Aluminum cold plates are compatible with water-glycol mixtures (ethylene or propylene glycol) containing approved corrosion inhibitors. For deionized water loops or direct dielectric fluid immersion, copper cold plates or nickel-plated aluminum variants are recommended to prevent galvanic corrosion.
Q: How do you prevent internal leakage during operation?
A: Internal O-rings and mechanical gaskets are eliminated from the fluid path by utilizing controlled atmosphere vacuum brazing or friction stir welding. Every production unit undergoes 100% helium mass spectrometer leak testing prior to release.
Q: What is your standard lead time for prototypes versus production?
A: Standard prototyping typically requires 3 to 4 weeks following drawing and 3D model approval. Volume production lead times range from 6 to 8 weeks depending on material grade availability and surface treatment schedules.
Q: Can you match the mounting footprint of specific power semiconductor modules?
A: Yes. Custom mounting hole patterns, flatness tolerances, and integrated fluid ports are routinely machined to interface directly with standard IGBT, MOSFET, and SiC power modules.
Q: What CAD formats do you accept for custom RFQs?
A: We accept STEP, IGES, and Parasolid 3D CAD files alongside 2D PDF drawings detailing critical tolerances, surface finishes, and pressure test specifications.
Request a Quote
To initiate an engineering review and quotation, provide the following parameters to our technical team:
Thermal Load: Total heat dissipation (W or kW) and maximum allowable baseplate temperature (°C).
Coolant Parameters: Fluid type, inlet temperature, and available flow rate (LPM or GPM).
Envelope Constraints: Maximum allowable dimensions (L × W × H).
Volume: Estimated annual usage (EAU) and prototype quantity required.
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